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Suomi – Mittalaitteet – Picosecond ultrasonics film thickness measurement tool

Awarded Contract award No deadline published

Description

Cassette-to-cassette measurement system using picosecond ultrasonics for materials characterization in semiconductor processes, enabling metal thickness metrology, implant monitoring, and thermal conductivity characterization.

Official source

Source: TED — Tenders Electronic Daily (Publications Office of the EU)

Always verify details on the official notice.

View the official notice

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