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Österreich – Laborgeräte, optische Geräte und Präzisionsgeräte (außer Gläser) – Silicon Austria Labs – Chips JU: Wafer bumper

Awarded Contract award No deadline published

Description

The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon Austria Labs GmbH.

Official source

Source: TED — Tenders Electronic Daily (Publications Office of the EU)

Always verify details on the official notice.

View the official notice

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