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Deutschland – Diverse Maschinen und Geräte für besondere Zwecke – Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P

Open Contract notice 3 days left Save

Description

Die-to-Wafer Bonder (IPMS-MRS14.1)

Official source

Source: TED - Tenders Electronic Daily (Publications Office of the EU)

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Avg. open tender · Industrial machinery
€1,396,600
1,594 open across Europe right now
Buyer track record on Licitop
264 notices tracked · 125 awarded
€651,275 in awarded contracts

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