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Finland – Laboratory, optical and precision equipments (excl. glasses) – Wafer metrology

Closed Contract notice

Description

The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.

Official source

Source: TED — Tenders Electronic Daily (Publications Office of the EU)

Always verify details on the official notice.

View the official notice

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