Zum Inhalt springen
Licitop.eu

Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment

Offen Auftragsbekanntmachung Noch 29 Tage Speichern

Beschreibung

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description This tender is to ensure that the devices packaged by the facility or our clients meet industry standards, the facility is planning to procure three reliability testing equipment/systems as follows: (1) Climatic chamber 1 for high temperature bias test, (2) Climatic chamber 2 for high temperature and high humidity bias test, (3) Thermal shock test chamber.

Amtliche Quelle

Quelle: Find a Tender Service (UK Cabinet Office / Crown Commercial Service)

Prüfen Sie alle Angaben stets in der amtlichen Bekanntmachung.

Zur amtlichen Bekanntmachung

Mehr von diesem Auftraggeber

Vollständiges Auftraggeberprofil

3 offene Ausschreibungen derzeit

Jüngste Vergaben

Ähnliche Ausschreibungen

Marktkontext

Vergabehistorie auf Licitop
6 erfasste Bekanntmachungen · 1 vergeben
318.234 € vergebenes Volumen

Verpassen Sie keine Ausschreibung wie diese

Erhalten Sie eine E-Mail zu neuen Ausschreibungen: Vereinigtes Königreich. Kostenlos.

Benachrichtigung einrichten